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The 157th Topical Symposium of the Magnetic Society of Japan
State-of-the-Art of RF Applied Magnetics in Electronics Packaging Technology
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Electronics packaging technology is a key issue to keep up with continuous needs for further miniature ICT equipments and corresponding broad-bandwidth information communication network, which closely collaborates with RF magnetic materials and their applications from design concepts, device/components development through last-minute electromagnetic noise countermeasure. Therefore interested members of the Magnetics Society of Japan and Japan Institute of Electronics Packaging continued joint technical meeting for the last two years. This year we plan such a joint meeting under the official sponsorship of the Magnetics Society Japan. Join us to find the idea, approach, topics and future prospects of the common interests between the magnetics and packaging communities.
| Date: |
December 6, 2007 (Thursday) 13:00-18:00 |
| Venue: |
Kagaku Kaikan (CSJ Chemistry Hall), 5F Room 501
1-5 Kanda-Surugadai, Chiyoda-ku, Tokyo
(3 mins. walk from Ochanomizu Station of JR or Shin-ochanomizu Station of Subway)
TEL: 03-3292-6162
URL: http://www.chemistry.or.jp/csj-en/about/map.html
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| In cooperation with: |
Electroncs Packaging Society, IEEE Magnetics Society Japan Chapter, IEEE Magnetics Society Sendai Chapter, Society of Nano Science and Technology, The Chemical Society of Japan, The Institute of Electrical Engineers of Japan, The Institute of Electronics, Information and Communication Engineers, The Japan Institute of Metals, The Japan Society of Applied Physics, The Physical Society of Japan, The Surface Science Society of Japan, Japan Society of Powder and Powder Metallurgy
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| Admission fee: |
Free (reserved reader and student)
2,000 Yen (member and corporate member)
4,000Yen (non-member) |
| Textbook: |
1,000 Yen (member, corporate member, non-member and student) |
| Further information: |
please contact The Magnetics Society of Japan.
TEL. 03-5281-0106
URL: http://www.wdc-jp.com/msj/intro/office.html |
| Organizers: |
M. Yamaguchi (Tohoku Univ.), T. Harada (NEC), S. Sugimoto (Tohoku Univ.), T. Uchiyama (Nagoya Univ.)
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| Program: |
| Chairperson: H. Inoue (NEC) |
| 13:00-13:30 |
“Application of Magnetic Materials to Electronic Packaging”
M. Yamaguchi (Tohoku Univ.) |
| 13:30-14:00 |
“Rolls of magnetic materials in electronics packaging”
T. Harada (NEC Corporation) |
| 14:00-14:50 |
“Integrated high frequency micromagnetic devices and their possibilities of application to RF-IC”
T. Sato (Shinshu Univ.) |
| Coffee Break 14:50-15:05 |
| Chairperson: M. Yamaguchi (Tohoku Univ.) |
| 15:05-15:55 |
“Modeling of Power Distribution Interconnection of Integrated Circuits and Packages”
O. Wada, U. Paoletti (Kyoto Univ.), K. Iokibe, R. Koga (Okayama Univ.) |
| 15:55-16:45 |
“RF Noise Countermeasure Using Plated Ferrite Thin Film”
S. Yoshida, K. Kondoh, H. Ono (NEC-Tokin Corporation) |
| 16:45-17:35 |
“Common Mode Voltage Reduction Technique for PCB/PKG Design”
A. Nakamura (Renesas Technology), Y. Mabuchi, A. Ohmae (Hitachi, Ltd.) |
| 17:35-18:00 |
“General Discussion” |
*Audio and/or visual recording is prohibited. |
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